* 1 r e p e t i t i v e p e a k r e v e r s e v o l t a g e * 2 r m s v o l t a g e * 3 c o n t i n u o u s r e v e r s e v o l t a g e * 4 m a x i m u m f o r w a r d v o l t a g e @ i = 3 . 0 a f p a r a m e t e r c o n d i t i o n s f o r w a r d r e c t i f i e d c u r r e n t f o r w a r d s u r g e c u r r e n t r e v e r s e c u r r e n t t h e r m a l r e s i s t a n c e d i o d e j u n c t i o n c a p a c i t a n c e s t o r a g e t e m p e r a t u r e s e e f i g . 2 8 . 3 m s s i n g l e h a l f s i n e - w a v e s u p e r i m p o s e d o n r a t e l o a d ( j e d e c m e t h o d e ) f = 1 m h z a n d a p p l i e d 4 v d c r e v e r s e v o l t a g e s y m b o l m i n . t y p . m a x . u n i t i o i f s m i r c j t s t g a a o c / w o c p f 3 . 0 1 0 0 5 . 0 + 1 7 5 - 5 5 4 7 o v = v t = 2 5 c r r r m j o v r = v t = 1 0 0 c r r m j j u n c t i o n t o a m b i e n t 4 0 2 5 0 r j a f m 3 0 1g f m 3 0 2g f m 3 0 3g 3 5 7 0 1 4 0 5 0 1 0 0 2 0 0 s y m b o l s v r r m ( v ) v r m s v r ( v ) ( v ) * 1 * 2 * 3 v f ( v ) * 4 f m 3 0 4g f m 3 0 5g 2 8 0 4 2 0 4 0 0 6 0 0 1 . 1 0 - 5 5 t o + 1 5 0 f m 3 0 6g f m 3 0 7g 8 0 0 1 0 0 0 5 6 0 7 0 0 5 0 1 0 0 2 0 0 4 0 0 6 0 0 8 0 0 1 0 0 0 o ( c ) o p e r a t i n g t e m p e r a t u r e t , j f m 3 0 8g 1 3 0 0 9 1 0 1 3 0 0 0 . 2 7 2 ( 6 . 9 ) 0 . 2 4 8 ( 6 . 3 ) 0 . 0 1 2 ( 0 . 3 ) ty p . 0 . 1 8 9 ( 4 . 8 ) 0 . 1 6 5 ( 4 . 2 ) 0 . 0 9 8 ( 2 . 5 ) 0 . 0 7 5 ( 1 . 9 ) 0 . 0 4 8 ( 1 . 2 ) ty p . 0 . 0 4 8 ( 1 . 2 ) ty p . fm301g thru fm308g chip silicon rectifier 1.0a surface mount general purpose rectifiers -50v-1300v features batch process design, excellent power dissipation offers. better reverse leakage current and thermal resistance. low profile surface mounted application in order to optimize board space. high current capability. lead-free parts meet environmental standards of mil-std-19500 /228 high surge capability. glass passivated chip junction. ? suffix "-h" indicates halogen-free parts, ex. fm301g-h. ? ? ? ? ? ? mechanical data ? ? ? ? ? ? epoxy: ul94-v0 rated flame retardant case : molded plastic, terminals : solder plated, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any weight : 0.19 gram do-214ab / smc approximated page 1/2 @ 2010 copyright by american first semiconductor sma package outline dimensions in inches and (millimeters) maximum ratings (at t =25 o c unless otherwise noted)
.1 1.0 10 100 rating and characteristic curves fig.3 - typical reverse characteristics reverse leakage current , ( m a) 0 20 40 60 80 100 120 140 .01 t =100 c j t =25 c j 0.1 1.0 .01 10 50 characteristics inst ant aneous for w ard current ,(a) for w ard vol t age,(v) pulse width 300us 1% duty cycle .6 .7 .8 .9 1.0 1.1 1.2 1.3 3.0 t =25 c j fig.2-typical for w ard current dera ting cur ve a verage for w ard current ,(a) 0.5 1.0 1.5 2.0 2.5 3.0 single phase half w ave 60hz resistive or inductive load fig.4-maximum non-repetitive for w ard surge current fig.5-typical junction cap acit ance reverse vol t age,(v) junction cap acit ance,(pf) 140 120 100 80 60 40 20 0 .01 .05 .1 .5 1 5 10 50 100 fig.1-typical for w ard 0 0 20 40 60 80 100 120 140 160 180 200 ambient tempera ture,( c) percent of ra ted peak reverse vol t age,(%) 25 0 50 75 100 125 number of cycles a t 60hz 1 10 5 50 100 t =25 c j 8.3ms single half sine w ave jedec method peak for w ard surge current ,(a) fm301g thru fm308g page 2/2 www.first-semi.com
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